EnvisionTEC, a leading global manufacturer of professional grade 3D printers and materials, previewed the Vector 3SP and the Micro Plus, at the International CES 2016 in Las Vegas, Nevada.

The Vector 3SP joins the industrial 3D printer lineup, filling a niche between the entry level ULTRA 3SP series and the large-frame family, consisting of the Xtreme 3SP and the Xede 3SP models.  With a build envelope that is 29% larger than the ULTRA 3SP, the Vector 3SP also gains additional speed capabilities.

The Vector 3SP includes a newly introduced single-frame design and a 15 in. touchscreen monitor on a swing arm to control the built-in, stand-alone PC.  All of EnvisionTEC’s current 3SP materials have been approved for use on the Vector 3SP, and the blade system will also open up new material options in the future.

The Vector 3SP is capable of producing functional end-use parts with the good surface finish.

Also making its North American debut, EnvisionTEC’s Micro Plus line includes two variations, the Micro Plus Hi-Res and the Micro Plus Advantage.  The updated desktop system features a new body style, a touchscreen, and an integrated, embedded PC with Wi-Fi capability.  By eliminating the need to connect the Micro Plus directly to a PC, users have a stable stand-alone system with the added convenience of a touchscreen. Files for printing can be quickly and easily transferred from any network computer directly to the Micro Plus via Wi-Fi.

The Micro Plus Hi-Res provides a build envelope of 45 x 28 x 100 mm with 30 micron resolution in X and Y.  The Micro Plus Advantage provides a 60 x 45 x 100 mm build envelope with 60 micron resolution in X and Y.  Both models feature a dynamic Z resolution (material dependent) that varies between 25 and 75 micron.  The Micro Plus 3D printers can produce functional parts with exceptional surface quality without sacrificing speed.  Materials available for the line include solutions for a range of applications, including jewelry, toy, medical, industrial design and engineering and more.

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