DSM Somos® introduced a new software application allowing SL users to create light-weight prototypes having enhanced structural integrity.

Based on patented technology from the Milwaukee School of Engineering (MSOE), TetraShell™ hollow build software will use MSOE’s TetraLattice* technology to facilitate the manufacture of hollow stereolithography parts with variable skin thicknesses, supported by a patented and proprietary TetraLattice™ support structure. Potential application areas include investment casting patterns, reduced- density metal clad composite structures and light-weight large, thick-sectioned parts.

The TetraShell software is a proprietary DSM Somos application module supported by Materialise’s Magics™ software and can easily be used on all current SL equipment. Beta testing is now underway, with widespread availability of the software in conjunction with Somos resins expected by year end.

www.dsm.com

MPF