EnvisionTEC, Inc., a leading manufacturer of proprietary 3D rapid manufacturing solutions, unveiled the newest 3D printer in its 3SP line, the Xede® 3SP™, at the Euromold 2013. Earlier in 2013, the company introduced the 3SP™ (Scan, Spin and Selectively Photocure) technology. This approach to 3D printing uses a multi-cavity laser diode with an orthogonal mirror spinning at 20,000 rpm. One of the advantages of this technology is that it expands on the build size capability of EnvisionTEC’s DLP technology, enabling EnvisionTEC to produce 3D printers with a large format such as the new Xede® 3SP™.
With a build envelope of 18 in. x 18 in. x 18 in., the Xede® 3SP™ allows for the production of exceptionally large 3D parts, and builds at fast build speeds without sacrificing surface quality and part accuracy. Accurate parts can be printed quickly from STL files regardless of geometric complexity with no signs of stairstepping on the inner and outer surfaces. Each 3D printer is delivered and installed with all the relevant software to enable automatic generation of supports and perfect model production.
The Xede® 3SP™ from EnvisionTEC can be used to produce everything from concept models to functional parts.
Industries that can benefit from the larger build envelope of the Xede® 3SP™:
Animation and Entertainment
Architecture and Art
Consumer Packaged Goods