PostProcess Technologies Inc., announced another patent granted in the United States. U.S. Patent No. 10,737,440, “Apparatus and Method for Support Removal,” issued August 11, 2020, covers PostProcess Technologies’ Submersed Vortex Cavitation (SVC) technology.
The SVC technology is part of PostProcess’s family of 3D printed polymer support removal and resin removal solutions for additive manufacturing. This approach works in combination with patent-pending detergents and proprietary software to ensure that 3D printed parts are uniformly, consistently, and reliably exposed to detergent and cavitation as they undergo post-printing.
Originally filed in June of 2016, this patent is one of more than 50 that PostProcess has filed worldwide. Corresponding patent applications for the SVC technology are pending in countries worldwide. The granting of this patent in the U.S. effectively confirms the revolutionary, distinctive nature of the technology put forward by PostProcess.