Solvay adds 10% carbon fiber filled KetaSpire polyetheretherketone (PEEK) and neat Radel polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat-Additive Manufacturing (AM) software. These products complement the neat KetaSpire PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat-AM platform.
The e-Xstream software offers accurate, predictive modeling data for Solvay’s AM filaments over a range of critical characteristics, including detailed warpage and residual stress, to help designers and engineers optimize the process and minimize part deformation before printing. Digimat further enables design validation by predicting the printed part performance (stiffness, strength, etc.) as a function of the material and the printing process parameters.
“With the addition of Solvay’s new AM grades, we now have a wider portfolio of 3D printing grades in Digimat to provide materials to push the design and application boundaries in this dynamic market,” adds Roger Assaker, CEO of e-Xstream engineering and Chief Material Strategist for MSC Software.