GE Aviation is acquiring five GE Additive Concept Laser M Line systems. The first four M Line systems will be installed at GE Aviation’s Additive Technology Center (ATC) in West Chester, Ohio during 2022. A fifth M Line system will be installed at … [Read more...] about GE Aviation invests in five M Line metal additive production systems
News
Under Desktop Metal, EnvisionTEC introduces ETEC brand
Desktop Metal (NYSE: DM), a global leader in additive manufacturing technologies for mass production, announced the launch of ETEC, a new 3D printing brand that will enable EnvisionTEC, the original inventor of digital light processing (DLP) … [Read more...] about Under Desktop Metal, EnvisionTEC introduces ETEC brand
Minnesota researchers say they’ve created the first fully 3D-printed OLED display
By Chris Newmarker University of Minnesota Twin Cities researchers used a customized printer to fully 3D print a flexible organic light-emitting diode (OLED) display. The research team members — based at U of M mechanical engineering professor … [Read more...] about Minnesota researchers say they’ve created the first fully 3D-printed OLED display
3D Printing booms as result of COVID-19 and shifting consumer demand, says report
Formlabs, a leading 3D printing company, released its 2022 3D Printing Applications Report detailing how 3D printing adoption and use cases have evolved over the past two years. Since March 2020, 3D printing adoption rates have skyrocketed as … [Read more...] about 3D Printing booms as result of COVID-19 and shifting consumer demand, says report
Western Sydney and GE Additive for partnership to advance metal additive manufacturing
Workers in Western Sydney will learn to produce the next wave of space technology and high-tech componentry as part of the first industry-led short courses rolled out under the NSW Government’s $37 million New Education and Training Model … [Read more...] about Western Sydney and GE Additive for partnership to advance metal additive manufacturing
HP plans to use 3D printing to help eliminate single-use PET packaging
In its continuing efforts to drive environmental sustainability, HP Inc. announced the acquisition of Choose Packaging, a packaging development company and inventor of the zero-plastic paper bottle. Choose’s patented technology provides an … [Read more...] about HP plans to use 3D printing to help eliminate single-use PET packaging
Additive Manufacturer Green Trade Association announces new members
The Additive Manufacturer Green Trade Association (AMGTA), a global trade organization created to promote the environmental benefits of additive manufacturing (AM), announced that five additional leading AM companies have joined the trade group to … [Read more...] about Additive Manufacturer Green Trade Association announces new members
America Makes announces $500,000 supply chain related project call
America Makes announced a new project call with a total of $500,000 available in project funding today. The Leveraging Additive for High Velocity Applications (LAVA) project will seek to mitigate variances in additive manufacturing (AM) high velocity … [Read more...] about America Makes announces $500,000 supply chain related project call
Phillips Federal to acquire a WarpSPEE3D Metal AM printer
Developed by Australian company SPEE3D, WarpSPEE3D CSAM technology will be assigned at Phillips Federal's Center of Innovation co-located at the Rock Island Arsenal's Additive Manufacturing Center of Excellence. Phillips Federal and the US Army will … [Read more...] about Phillips Federal to acquire a WarpSPEE3D Metal AM printer
Nano Dimension establishes Additively Manufactured Electronics (AME) NanoLab Facility for multi-layer printed electronics
Nano Dimension Ltd. announced a collaboration with TTM Technologies, Inc. (“TTM”) to open its first AME NanoLab at TTM’s Advanced Manufacturing Center in Stafford Springs, CT. The AME NanoLab Network will enable customers and researchers to … [Read more...] about Nano Dimension establishes Additively Manufactured Electronics (AME) NanoLab Facility for multi-layer printed electronics
