Carbon, the developers of Continuous Liquid Interface Production (CLIP) and Two-Stage Cure, announces the addition of three new engineering resins to the CLIP platform.
The EPX 81 resin is part of the company’s new Epoxy material family. EPX 81 was designed in collaboration with customers for high precision industrial applications like electrical connectors. An accurate high strength engineering material, its mechanical properties are comparable to 20% glass-filled PBT. It has a heat deflection temperature of 140°C and good abrasion resistance.
With mechanical properties that are well suited for electrical connector applications, Delphi produced highly detailed connectors with wire terminal retention force performance that exceeded their current injection molding production material.
CE 221 is the newest member of the Cyanate Ester family, offering material properties comparable to glass-filled Nylon. With a 230°C heat deflection temperature, strength, and stiffness, CE 221 suits applications that need long term thermal stability, like under-the-hood components, electronics assemblies, and industrial products.
The Ebullient processor cooling module uses CE 221 to efficiently route coolant inside of servers and workstations while withstanding elevated temperature. The material also offers precision surface finish.
UMA 90 is suited for use in manufacturing jigs, fixtures, and prototypes that require enhanced toughness.
Carbon’s internal design studio team designed and validated this cable organizer, quickly iterating on its cable clamping features and custom fit-to-desk attachments. UMA 90 is available in black, white, gray, and a CMYK color pack that allows custom color mixing.